Flip-chip assembly for packaging of SiC diodes working at high temperatures up to 350 C

Marcin Myśliwiec

Abstract

n/a
Diploma typeMaster of Science
Author Marcin Myśliwiec IMiO
Marcin Myśliwiec,,
- The Institute of Microelectronics and Optoelectronics
Title in PolishPołączenia typu flip-chip w montażu diod SiC pracujących w temperaturach do 350 C
Supervisor Ryszard Kisiel IMiO
Ryszard Kisiel,,
- The Institute of Microelectronics and Optoelectronics
Certifying unitFaculty of Electronics and Information Technology (FEIT)
Affiliation unitThe Institute of Microelectronics and Optoelectronics (MO)
Languagepl polski
StatusFinished
Defense Date08-02-2013
Issue date (year)2013

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