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## Physical model of arcing phenomenon in magnetron sputtering processes

### Zofia Domanowska

#### Abstract

The magnetron sputtering process is one of the plasma applications used on a large scale in industry. This process is used, among others, for coating optical elements with anti-reflective layers, for coating everyday objects with anti-deterioration layers, and for the production of touch screens. The magnetron sputtering process takes place under conditions of reduced pressure. The basic components of the sprayed layers are the target material and the working gas, e.g. argon. The resulting layers are usually poorly conductive coatings. Due to the design of the plasma system and the physical nature of the PVD process, the layers are applied not only to the target element, but also to the surface of the target. An increase in the thickness of the dielectric layer and the accumulation of charge on it leads to a decrease in the efficiency of the process and arcing. These discharges lead to destruction of the resulting layers and significant reduction of their quality. In order to prevent the glow discharge from transforming into arc discharge, appropriate power supplies are used, which enable pulse voltage supply and turn off when the arc is detected, thanks to which the accumulated charge can discharge. System electrode - insulating layer - plasma may be approximated using an electrical circuit comprising a capacitor and a resistor. As a result of the sputtering process, a dielectric layer is formed in the capacitor. Such a model enables simulation of the value of the deposited charge and the influence of particular parameters, such as the size of the covers, the applied voltage and the material used, on the course of the process. The analysis of simulation results allows us to observe the efficiency of pulse voltage delivery. In this work, the conditions under which arcing takes place are analyzed. A simulation of the magnetron sputtering process was performed, the results of which allow to determine the process parameters, thanks to which it is possible to limit the occurrence of arcing. It has been shown that the use of appropriate signal filling, with previously selected process parameters, allows for efficient magnetron sputtering without arcing.
Diploma type
Engineer's / Bachelor of Science
Diploma type
Engineer's thesis
Author
Zofia Domanowska (FP) Zofia Domanowska,, Faculty of Physics (FP)
Title in Polish
Model zjawiska powstawania wyładowania łukowego w procesach rozpylania magnetronowego
Supervisor
Agata Fronczak (FP/PCSD) Agata Fronczak,, Physics of Complex Systems Divison (FP/PCSD)Faculty of Physics (FP)
Certifying unit
Faculty of Physics (FP)
Affiliation unit
Physics of Complex Systems Divison (FP/PCSD)
Study subject / specialization
, Fizyka Techniczna
Language
(pl) Polish
Status
Finished
Defense Date
11-02-2019
Issue date (year)
2019
Reviewers
Piotr Fronczak (FP/PCSD) Piotr Fronczak,, Physics of Complex Systems Divison (FP/PCSD)Faculty of Physics (FP) Agata Fronczak (FP/PCSD) Agata Fronczak,, Physics of Complex Systems Divison (FP/PCSD)Faculty of Physics (FP)
Keywords in Polish
Rozpylanie magnetronowe, wyładowanie łukowe, plazma, magnetron, kondensator
Keywords in English
magnetron sputtering, arc discharge, plasma, magnetron, capacitor
Abstract in Polish
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praca_inżynierska_Zofia_Domanowska.pdf
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Identyfikator pracy APD: 27202

Uniform Resource Identifier
https://repo.pw.edu.pl/info/bachelor/WUTfd987b36efe74800b0c9bf632f92bfeb/
URN
urn:pw-repo:WUTfd987b36efe74800b0c9bf632f92bfeb

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