Evaluation of effect of silicon wafers slicing technologies on wafer geometry and damaged layer characteristics

Maciej Tkaczuk

Abstract

n/a
Diploma typeEngineer's / Bachelor of Science
Diploma typeEngineer's thesis
Author Maciej Tkaczuk (FMSE / DSMP)
Maciej Tkaczuk,,
- Division of Ceramic Materials and Polymers
Title in PolishPorównanie wpływu technologii cięcia płytek krzemowych na ich geometrię i charakter warstwy uszkodzonej
Supervisor Andrzej Olszyna (FMSE / DSMP)
Andrzej Olszyna,,
- Division of Ceramic Materials and Polymers

Certifying unitFaculty of Materials Science and Engineering (FMSE)
Affiliation unitDivision of Ceramic Materials and Polymers (FMSE / DSMP)
Languagepl polski
StatusFinished
Issue date (year)2008
Internal identifierIM-001319
Keywords in PolishMECHANIKA MATERIAŁÓW, OBRÓBKA MECHANICZNA MATERIAŁÓW, OBRÓBKA MECHANICZNA KRZEMU

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