Temperature Compensation Method for Mechanical Base of 3D-Structured Light Scanners
Marcin Adamczyk , Paweł Liberadzki , Robert Sitnik
AbstractThe effect of temperature on three-dimensional (3D) structured light scanners is a very complex issue that, under some conditions, can lead to significant deterioration of performed measurements. In this paper, we present the results of several studies concerning the effect of temperature on the mechanical base of 3D-structured light scanners. We also propose a software compensation method suitable for implementation in any existing scanner. The most significant advantage of the described method is the fact that it does not require any specialized artifact or any additional equipment, nor access to the thermal chamber. It uses a simulation of mechanical base thermal deformations and a virtual 3D measurement environment that allows for conducting virtual measurements. The results from the verification experiments show that the developed method can extend the range of temperatures in which 3D-structured light scanners can perform valid measurements by more than six-fold.
|Journal series||Sensors, [SENSORS-BASEL], ISSN 1424-8220, e-ISSN 1424-3210|
|Publication size in sheets||0.9|
|Keywords in English||3D scanner, temperature effect, 3D imaging, structured light, mechanical base of 3D scanner|
|ASJC Classification||; ; ;|
|Score||= 100.0, 08-06-2020, ArticleFromJournal|
|Publication indicators||= 0; = 0; : 2016 = 1.393; : 2018 = 3.031 (2) - 2018=3.302 (5)|
* presented citation count is obtained through Internet information analysis and it is close to the number calculated by the Publish or Perish system.