Conductive Paths and Connections on Polymer Substrates for Structural Electronics
Bartłomiej Wałpuski , Bartłomiej Podsiadły , Jakub Krzemiński , Marcin Słoma
AbstractStructural Electronics is a modern, still developing technique of manufacturing electrical circuit merged with a mechanical construction of device. This approach opens new possibilities like higher components density, cost effective short series and prototypes or manufacturing of electronics in almost any place like third world countries or space station. Inthis paper, a novel method of fully printed electronic devices manufacturing is presented. Use of specially prepared paste with silver nanoparticles and microflakes, whose manufacturing procedure is described, as well as sintering with near infrared, continuous wave laser allows to get less than 35 mΩ electrical resistivity of a 1206 SMD resistor single joint. Different 3D printed substrates were tested as well as mechanical and electrical properties of joints were measured. Finally, a simple circuit with LEDs ismanufactured, demonstrating the practical used of the presented technique.
|Journal series||Periodica Polytechnica Electrical Engineering and Computer Science, ISSN 2064-5260, e-ISSN 2064-5279, [0324-6000, 1587-3781], (N/A 20 pkt, Not active)|
|Publication size in sheets||0.5|
|Keywords in English||structural electronics, laser sintering, additive manufacturing, nanosilver conductive paste|
|ASJC Classification||; ; ; ; ;|
|Project||First TEAM/2016-1/7, Functional heterophase materials for structural electronics. Project leader: Słoma Marcin,
, Phone: +48 22234-8306, start date 01-10-2016, planned end date 31-03-2020, PW 1205, Implemented
|Score||= 20.0, 20-10-2019, ArticleFromJournal|
|Publication indicators||= 0; : 2016 = 0.524|
* presented citation count is obtained through Internet information analysis and it is close to the number calculated by the Publish or Perish system.