Experimental and numerical investigation of heat sink with phase change material for electronics cooling
Maciej Jaworski , Przemysław Krukowski
AbstractThe paper presents the results of the research on thermal performance characteristics of heat sinks with phase change materials (PCM) for electronics (microprocessors) cooling. The study was focused on a hybrid type of heat spreader that consists of two parts: conventional finned structure supported with fans and an aluminum block with holes that are filled with PCM. The finned part is responsible for the cooling in standard operational conditions of microprocessor while the PCM ontainer absorbs heat in transient states, e.g. in case of substantial increase of heat generated or in case of a failure of fans in basic part of a spreader. The thermal performance of the spreader was determined by means of computational simulations of selected transient conditions in the operation. The computational tool developed for the purpose of this study was validated with the use of experimental results obtained at a special stand-up designed for this research. Temporal variations of temperature in the crucial parts of the unit, i.e. at the contact surface between heat spreader and microprocessor, were presented in the paper. Also the influence of main geometrical parameters of the PCM container, as well as material used for the metal block, was investigated.
|Publication size in sheets||0.85|
|Book||Kruzel Marcin, Kuczyński Waldemar (eds.): Contemporary Issues of Heat and Mass Transfer, vol. 1, 2019, Politechnika Koszalińska, ISBN 978-83-7365-513-3, 534 p.|
|Keywords in English||electronics cooling, phase change materials, numerical simulation, parametric analysis|
|Score||= 20.0, 17-01-2020, ChapterFromConference|
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