Polyimide Foil Flip-Chip Direct Bonding

Martin Deckert , Michael T. Lippert , Jakub Krzemiński , Kentaroh Takagaki , Frank W. Ohl , Bertram Schmidt

Abstract

Recent developments in the field of neuroprosthetics have created a demand for cost-effective advanced bonding techniques to mount polymer-based, thin-film, multi-electrode arrays onto PCBs. Low thicknesses of polymer substrates present challenges for common packaging technologies. Here we implemented a cost-effective direct bonding process of polyimide thin-film electrode arrays using vapor phase soldering. Our polymer foil is composed of PI-2611 and contains embedded gold/platinum/chromium traces. Contact pads are platinum coated and no under bump metallization is required. Instead of using wire bonding techniques, the contact pads are flip-chip bonded directly onto the PCB using a lead free solder paste. Transfer of the foil is carried out by vacuum placement. Soldering is subsequently performed in a vapor phase soldering oven. In contrast to wire bonding on flexible substrate materials, vapor phase soldering results in enhanced contact yield of approximately 99%. The landing area of the thin-film electrode, containing the soldered contact pads, is then passivated with a low-shrinkage epoxy in a pin-transfer process. Using such a low-shrinkage material is paramount to achieve sufficient longterm stability of the solder connections and to stabilize the thin polyimide substrate.
Author Martin Deckert
Martin Deckert,,
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, Michael T. Lippert
Michael T. Lippert,,
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, Jakub Krzemiński (FM / IMBE)
Jakub Krzemiński,,
- The Institute of Metrology and Biomedical Engineering
, Kentaroh Takagaki
Kentaroh Takagaki,,
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, Frank W. Ohl
Frank W. Ohl,,
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, Bertram Schmidt
Bertram Schmidt,,
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Pages8346897-1 - 8346897-4
Publication size in sheets0.3
Book 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition. Proceedings, vol. I, 2018, Institute of Electrical and Electronics Engineers, ISBN 9781538623091, 534 p.
Keywords in Englishpolyimide, foil, flip-chip, packaging, bonding, FR4
DOIDOI:10.23919/EMPC.2017.8346897
Languageen angielski
Score (nominal)20
Score sourcepublisherList
ScoreMinisterial score = 20.0, 14-11-2019, ChapterFromConference
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