Thermal and Mechanical Properties of Sintered Ag Layers for Power Module Assembly

Marcin Myśliwiec , Ryszard Kisiel

Abstract

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Author Marcin Myśliwiec (FEIT / MO)
Marcin Myśliwiec,,
- The Institute of Microelectronics and Optoelectronics
, Ryszard Kisiel (FEIT / MO)
Ryszard Kisiel,,
- The Institute of Microelectronics and Optoelectronics
Pages29-34
Publication size in sheets0.5
Book Podgórski Jacek (eds.): Proc. of International Conference ”Microtechnology and Thermal Problems in Electronics”, 2013, Łódź, Poland, Politechnika Łódzka, ISBN 978-83-932197-1-1, 300 p.
Languageen angielski
Score (nominal)15
ScoreMinisterial score = 10.0, 04-09-2019, BookChapterMatConfByConferenceseries
Ministerial score (2013-2016) = 15.0, 04-09-2019, BookChapterMatConfByConferenceseries
Publication indicators WoS Citations = 5
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