Quantitative Thermal Microscopy Measurement with Thermal Probe Driven by dc+ac Current

Jerzy Bodzenta , Justyna Juszczyk , Anna Kaźmierczak-Bałata , Piotr Firek , Austin Fleming , Mihai Chirtoc

Abstract

Quantitative thermal measurements with spatial resolution allowing the examination of objects of submicron dimensions are still a challenging task. The quantity of methods providing spatial resolution better than 100 nm is very limited. One of them is scanning thermal microscopy (SThM). This method is a variant of atomic force microscopy which uses a probe equipped with a temperature sensor near the apex. Depending on the sensor current, either the temperature or the thermal conductivity distribution at the sample surface can be measured. However, like all microscopy methods, the SThM gives only qualitative information. Quantitative measuring methods using SThM equipment are still under development. In this paper, a method based on simultaneous registration of the static and the dynamic electrical resistances of the probe driven by the sum of dc and ac currents, and examples of its applications are described. Special attention is paid to the investigation of thin films deposited on thick substrates. The influence of substrate thermal properties on the measured signal and its dependence on thin film thermal conductivity and film thickness are analyzed. It is shown that in the case where layer thicknesses are comparable or smaller than the probe–sample contact diameter, a correction procedure is required to obtain actual thermal conductivity of the layer. Experimental results obtained for thin SiO 22 and BaTiO 33 layers with thicknesses in the range from 11 nm to 100 nm are correctly confirmed with this approach.
Author Jerzy Bodzenta - [Silesian University of Technology (PolSL)]
Jerzy Bodzenta,,
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- Politechnika Śląska
, Justyna Juszczyk - [Silesian University of Technology (PolSL)]
Justyna Juszczyk,,
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- Politechnika Śląska
, Anna Kaźmierczak-Bałata - [Silesian University of Technology (PolSL)]
Anna Kaźmierczak-Bałata,,
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- Politechnika Śląska
, Piotr Firek (FEIT / MO)
Piotr Firek,,
- The Institute of Microelectronics and Optoelectronics
, Austin Fleming - [Utah State University]
Austin Fleming,,
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, Mihai Chirtoc - [Institut de Thermique, Mécanique, Matériaux (ITheMM)]
Mihai Chirtoc,,
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Journal seriesInternational Journal of Thermophysics, ISSN 0195-928X
Issue year2016
Vol37
No7
Pages1-17
Publication size in sheets0.8
Conference18th International Conference on Photoacoustic and Photothermal Phenomena. (ICPPP18), 06-09-2015 - 10-09-2015, Novi Sad, Serbia
Keywords in EnglishFinite element method; Numerical analysis; Scanning thermal microscopy; Thermal conductivity measurement; Thin layers
ASJC Classification3104 Condensed Matter Physics
DOIDOI:10.1007/s10765-016-2080-y
URL http://link.springer.com/article/10.1007/s10765-016-2080-y#enumeration
Languageen angielski
Score (nominal)20
Score sourcejournalList
ScoreMinisterial score = 20.0, 30-06-2020, ArticleFromJournalAndMatConfByConferenceseries
Ministerial score (2013-2016) = 20.0, 30-06-2020, ArticleFromJournalAndMatConfByConferenceseries
Publication indicators Scopus Citations = 7; WoS Citations = 8; GS Citations = 13.0; Scopus SNIP (Source Normalised Impact per Paper): 2016 = 0.63; WoS Impact Factor: 2016 = 0.745 (2) - 2016=0.886 (5)
Citation count*13 (2020-08-30)
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* presented citation count is obtained through Internet information analysis and it is close to the number calculated by the Publish or Perish system.
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