Application of Direct Bonded Copper Substrates for Prototyping of Power Electronic Modules

Wojciech Grzesiak , Piotr Maćków , Tomasz Maj , Beata Synkiewicz , Krzysztof Witek , Ryszard Kisiel , Marcin Myśliwiec , Janusz Borecki , Tomasz Serzysko , Marek Żupnik

Abstract

Purpose – This paper aims to present certain issues in direct bonded copper (DBC) technology towards the manufacture of Al2O3 or AlN ceramic substrates with one or both sides clad with a copper (Cu) layer. Design/methodology/approach – As part of the experimental work, attempts were made to produce patterns printed onto DBC substrates based on four substantially different technologies: precise cutting with a diamond saw, photolithography, the use of a milling cutter (LPKF ProtoMat 93s) and laser ablation with differential chemical etching of the Cu layer. Findings – The use of photolithography and etching technology in the case of boards clad with a 0.2-mm-thick Cu layer, can produce conductive paths with a width of 0.4 mm while maintaining a distance of 0.4 mm between the paths, and in the case of boards clad with a 0.3-mm-thick copper layer, conductive paths with a width of 0.5 mm while maintaining a distance of 0.5 mm between paths. The application of laser ablation at the final step of removing the unnecessary copper layer, can radically increase the resolution of printed pattern even to 0.1/0.1 mm. The quality of the printed pattern is also much better. Research limitations/implications – Etching process optimization and the development of the fundamentals of technology and design of power electronic systems based on DBC substrates should be done in the future. A limiting factor for further research and its implementation may be the relatively high price of DBC substrates in comparison with typical PCB printed circuits. Practical implications – Several examples of practical implementations using DBC technology are presented, such as full- and half-bridge connections, full-wave rectifier with an output voltage of 48 V and an output current of 50 A, and part of a battery discharger controller and light-emitting diode illuminator soldered to a copper heat sink. Originality/value – The paper presents a comparison of different technologies used for the realization of precise patterns on DBC substrates. The combination of etching and laser ablation technologies radically improves the quality of DBC-printed patterns.
Author Wojciech Grzesiak
Wojciech Grzesiak,,
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, Piotr Maćków
Piotr Maćków,,
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, Tomasz Maj
Tomasz Maj,,
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, Beata Synkiewicz
Beata Synkiewicz,,
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, Krzysztof Witek
Krzysztof Witek,,
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, Ryszard Kisiel IMiO
Ryszard Kisiel,,
- The Institute of Microelectronics and Optoelectronics
, Marcin Myśliwiec IMiO
Marcin Myśliwiec,,
- The Institute of Microelectronics and Optoelectronics
, Janusz Borecki
Janusz Borecki,,
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, Tomasz Serzysko
Tomasz Serzysko,,
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, Marek Żupnik
Marek Żupnik,,
-
Journal seriesCircuit World, ISSN 0305-6120
Issue year2016
Vol42
No1
Pages23-31
Publication size in sheets0.5
Conference39th International Microelectronics and Packaging Conference (IMAPS-CPMT Poland 2015), 20-09-2015 - 23-09-2015, Gdańsk, Polska
Keywords in EnglishSMT, DBC substrates, Power electronics modules
DOIDOI:10.1108/CW-10-2015-0051
URL http://www.emeraldinsight.com/doi/full/10.1108/CW-10-2015-0051
Languageen angielski
Score (nominal)20
ScoreMinisterial score = 15.0, 27-03-2017, ArticleFromJournalAndMatConf
Ministerial score (2013-2016) = 20.0, 27-03-2017, ArticleFromJournalAndMatConf
Publication indicators WoS Impact Factor: 2016 = 0.727 (2) - 2016=0.916 (5)
Citation count*0
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* presented citation count is obtained through Internet information analysis and it is close to the number calculated by the Publish or Perish system.
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