Die attach by diffusion Sn-Ag-Sn soldering in high temperature electronics applications

Marcin Myśliwiec , Ryszard Kisiel , Tomasz Fałat

Abstract

n/a
Author Marcin Myśliwiec (FEIT / MO)
Marcin Myśliwiec,,
- The Institute of Microelectronics and Optoelectronics
, Ryszard Kisiel (FEIT / MO)
Ryszard Kisiel,,
- The Institute of Microelectronics and Optoelectronics
, Tomasz Fałat
Tomasz Fałat,,
-
Pages81-82
Publication size in sheets0.3
Book Blecha Tomas, Wohlrabe Heinz, Mracek Lukas, Rericha Tomas, Soukup Radek, Nicolics Johann (eds.): Extended Abstracts: ISSE 2016, 39th International Spring Seminar on Electonics Technology, 2016, University of West Bohemia, ISBN 978-80-261-0618-0, 266 p.
ProjectThe Development of Design, Processing and Testing Methods of the Electronic Devices and Materials for Microelectronics and Optoelectronics. Project leader: Szczepański Paweł, , Phone: (48 22) 234 58 70, start date 01-01-2015, planned end date 31-12-2015, end date 31-05-2016, IMiO/2015/STATUT/1, Implemented
WEiTI Działalność statutowa
Languageen angielski
Score (nominal)15
ScoreMinisterial score = 15.0, 04-09-2019, BookChapterMatConfByConferenceseries
Ministerial score (2013-2016) = 15.0, 04-09-2019, BookChapterMatConfByConferenceseries
Publication indicators WoS Citations = 2
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