Challenges in packaging of IR detectors – technology of elastic electrical connections

Marcin Myśliwiec , Arkadiusz Lewandowski , Wojciech Wiatr , Jerzy Weremczuk , Zbigniew Szczepański , Ryszard Kisiel


This paper describes the study on flexible connections application in IR detector package. Such a connection is used between two modules in single package. One module is IR detector operating at -73 °C, other is electronic controlling circuit operating at room temperature. Flexible electrical connection must provide good electrical parameters in both DC and RF regime as well as poor thermal conductivity. 35 µm epoxy-phenolic foil with 5 µm Ni film and special RF compatible Ground-Signal-Ground geometry was successfully applied as connection. Low eutectic temperature InSn solder was used for soldering flexible connection to both IR detector and electronic circuit. Two types of soldering processes were investigated: bump and lap type. Flexible connection was tested for DC operation with long term stability test and RF parameters were determined. Authors found that both joining techniques are suitable for application in IR photodetector devices. However lap type joint is easier to apply in technological process, therefore it will be applied in final assembly.
Author Marcin Myśliwiec (FEIT / MO)
Marcin Myśliwiec,,
- The Institute of Microelectronics and Optoelectronics
, Arkadiusz Lewandowski (FEIT / PE)
Arkadiusz Lewandowski,,
- The Institute of Electronic Systems
, Wojciech Wiatr (FEIT / PE)
Wojciech Wiatr,,
- The Institute of Electronic Systems
, Jerzy Weremczuk (FEIT / PE)
Jerzy Weremczuk,,
- The Institute of Electronic Systems
, Zbigniew Szczepański (FEIT / MO)
Zbigniew Szczepański,,
- The Institute of Microelectronics and Optoelectronics
, Ryszard Kisiel (FEIT / MO)
Ryszard Kisiel,,
- The Institute of Microelectronics and Optoelectronics
Journal seriesIOP Conference Series: Materials Science and Engineering, ISSN 1757-8981, e-ISSN 1757-899X
Issue year2016
Publication size in sheets0.5
Conference39th International Microelectronics and Packaging Conference (IMAPS-CPMT Poland 2015), 20-09-2015 - 23-09-2015, Gdańsk, Polska
ProjectIntegration of infrared detectors cooled thermoelectrically or operating in ambient temperature with wideband electronics . Project leader: Pankanin Grzegorz, , Phone: +48 22 234 7732, application date 30-01-2013, start date 01-10-2013, end date 30-11-2015, ISE/2013/NCBiR/Intir, Completed
WEiTI Projects financed by NCRD [Projekty finansowane przez NCBiR (NCBR)]
Languageen angielski
Score (nominal)15
Score sourceconferenceIndex
ScoreMinisterial score = 15.0, 01-02-2020, ArticleFromJournalAndMatConfByConferenceseries
Ministerial score (2013-2016) = 15.0, 01-02-2020, ArticleFromJournalAndMatConfByConferenceseries
Publication indicators Scopus Citations = 2; WoS Citations = 1; GS Citations = 2.0
Citation count*2 (2020-09-24)
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* presented citation count is obtained through Internet information analysis and it is close to the number calculated by the Publish or Perish system.
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