Challenges in packaging of IR detectors – technology of elastic electrical connections
Marcin Myśliwiec , Arkadiusz Lewandowski , Wojciech Wiatr , Jerzy Weremczuk , Zbigniew Szczepański , Ryszard Kisiel
AbstractThis paper describes the study on flexible connections application in IR detector package. Such a connection is used between two modules in single package. One module is IR detector operating at -73 °C, other is electronic controlling circuit operating at room temperature. Flexible electrical connection must provide good electrical parameters in both DC and RF regime as well as poor thermal conductivity. 35 µm epoxy-phenolic foil with 5 µm Ni film and special RF compatible Ground-Signal-Ground geometry was successfully applied as connection. Low eutectic temperature InSn solder was used for soldering flexible connection to both IR detector and electronic circuit. Two types of soldering processes were investigated: bump and lap type. Flexible connection was tested for DC operation with long term stability test and RF parameters were determined. Authors found that both joining techniques are suitable for application in IR photodetector devices. However lap type joint is easier to apply in technological process, therefore it will be applied in final assembly.
|Journal series||IOP Conference Series: Materials Science and Engineering, ISSN 1757-8981, e-ISSN 1757-899X|
|Publication size in sheets||0.5|
|Conference||39th International Microelectronics and Packaging Conference (IMAPS-CPMT Poland 2015), 20-09-2015 - 23-09-2015, Gdańsk, Polska|
|Project||Integration of infrared detectors cooled thermoelectrically or operating in ambient temperature with wideband electronics . Project leader: Pankanin Grzegorz,
, Phone: +48 22 234 7732, application date 30-01-2013, start date 01-10-2013, end date 30-11-2015, ISE/2013/NCBiR/Intir, Completed
|Score|| = 15.0, 01-02-2020, ArticleFromJournalAndMatConfByConferenceseries|
= 15.0, 01-02-2020, ArticleFromJournalAndMatConfByConferenceseries
|Publication indicators||= 2; = 1; = 2.0|
|Citation count*||2 (2020-07-01)|
* presented citation count is obtained through Internet information analysis and it is close to the number calculated by the Publish or Perish system.