Solid-Liquid Interdiffusion Bonding based on Au-Sn Intermetallic for High Temperature Applications
Ryszard Kisiel , Marcin Myśliwiec
|Book||Extended Abstracts of 41th International Spring Seminar on Electronics Technology ISSE 2018, 2018, University of Novi Sad, Serbia, ISBN 9788660220426, 200 p.|
|Score|| = 15.0, 11-03-2019, BookChapterMatConf|
= 15.0, 11-03-2019, BookChapterMatConf
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