Solid-Liquid Interdiffusion Bonding based on Au-Sn Intermetallic for High Temperature Applications

Ryszard Kisiel , Marcin Myśliwiec

Abstract

n/a
Author Ryszard Kisiel (FEIT / MO)
Ryszard Kisiel,,
- The Institute of Microelectronics and Optoelectronics
, Marcin Myśliwiec - [CENTRAL LABORATORY OF CEZAMAT (CEZAMAT)]
Marcin Myśliwiec,,
-
- Centrum Zaawansowanych Materiałów i Technologii CEZAMAT
Pages49-50
Book Extended Abstracts of 41th International Spring Seminar on Electronics Technology ISSE 2018, 2018, University of Novi Sad, Serbia, ISBN 9788660220426, 200 p.
Languageen angielski
Score (nominal)15
ScoreMinisterial score = 15.0, 21-05-2018, BookChapterMatConf
Ministerial score (2013-2016) = 15.0, 21-05-2018, BookChapterMatConf
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