Aspects of applying flip-chip technology for SiC power devices assembly

Marcin Myśliwiec , Marek Guziewicz , Ryszard Kisiel

Abstract

The aim of our paper is to consider the possibility of applying flip-chip technology for assembly of SiC Schottky diode into a ceramic package. Ag micropowder was used for assembly SiC structure to DBC interposer of the ceramic package. Ag or Au balls were used as flip-chip connection material. The parameters of I-V characteristics were used as a quality factor to determine the Schottky diode after hermetization into ceramic package in comparison with bare SiC diode.
Author Marcin Myśliwiec (FEIT / MO)
Marcin Myśliwiec,,
- The Institute of Microelectronics and Optoelectronics
, Marek Guziewicz (FEIT / MO)
Marek Guziewicz,,
- The Institute of Microelectronics and Optoelectronics
, Ryszard Kisiel (FEIT / MO)
Ryszard Kisiel,,
- The Institute of Microelectronics and Optoelectronics
Pages90-93
Book Organizing Committee of ISSE: 36th International Spring Seminar on Electronics Technology (ISSE), 2013, 2013, USA, IEEE Xplore Digital Library, ISBN 978-606-613-064-6, 447 p.
DOIDOI:10.1109/ISSE.2013.6648221
URL http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6648221
Languageen angielski
Score (nominal)15
Score sourceconferenceIndex
ScoreMinisterial score = 10.0, 11-02-2020, BookChapterMatConfByIndicator
Ministerial score (2013-2016) = 15.0, 11-02-2020, BookChapterMatConfByIndicator
Publication indicators WoS Citations = 1; GS Citations = 1.0
Citation count*1 (2014-02-10)
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* presented citation count is obtained through Internet information analysis and it is close to the number calculated by the Publish or Perish system.
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