Aspects of applying flip-chip technology for SiC power devices assembly
Marcin Myśliwiec , Marek Guziewicz , Ryszard Kisiel
AbstractThe aim of our paper is to consider the possibility of applying flip-chip technology for assembly of SiC Schottky diode into a ceramic package. Ag micropowder was used for assembly SiC structure to DBC interposer of the ceramic package. Ag or Au balls were used as flip-chip connection material. The parameters of I-V characteristics were used as a quality factor to determine the Schottky diode after hermetization into ceramic package in comparison with bare SiC diode.
|Book||Organizing Committee of ISSE: 36th International Spring Seminar on Electronics Technology (ISSE), 2013, 2013, USA, IEEE Xplore Digital Library, ISBN 978-606-613-064-6, 447 p.|
|Score|| = 10.0, 11-02-2020, BookChapterMatConfByIndicator|
= 15.0, 11-02-2020, BookChapterMatConfByIndicator
|Publication indicators||= 1; = 1.0|
|Citation count*||1 (2014-02-10)|
* presented citation count is obtained through Internet information analysis and it is close to the number calculated by the Publish or Perish system.