The Determination of the Grain Boundary Width of Ultrafine Grained Copper and Nickel from Electrical Resistivity Measurements
R. K. Islamgaliev , Krystyna Pękała , M. Pekala , R. Z. Valiev
AbstractThe grain size distribution of copper and nickel processed by severe plastic deformation was studied by transmission electron microscopy. The temperature dependence of electrical resistivity in the temperature range from 20 to 300 K is presented. The tunnel model of electrical resistivity of grain boundaries is discussed. The width of the potential barrier at grain boundaries in copper and nickel is determined. Larger values of potential barriers are noted in ultrafine grained materials in comparison to the crystallographic width of grain boundaries.
|Journal series||Physica Status Solidi A-Applications and Materials Science, ISSN 1862-6300|
|ASJC Classification||; ; ; ; ;|
|Publication indicators||: 2014 = 0.901; : 2008 = 1.205 (2) - 2008=1.179 (5)|
|Citation count*||12 (2014-08-27)|
* presented citation count is obtained through Internet information analysis and it is close to the number calculated by the Publish or Perish system.