The Determination of the Grain Boundary Width of Ultrafine Grained Copper and Nickel from Electrical Resistivity Measurements

R. K. Islamgaliev , Krystyna Pękała , M. Pekala , R. Z. Valiev

Abstract

The grain size distribution of copper and nickel processed by severe plastic deformation was studied by transmission electron microscopy. The temperature dependence of electrical resistivity in the temperature range from 20 to 300 K is presented. The tunnel model of electrical resistivity of grain boundaries is discussed. The width of the potential barrier at grain boundaries in copper and nickel is determined. Larger values of potential barriers are noted in ultrafine grained materials in comparison to the crystallographic width of grain boundaries.
Author R. K. Islamgaliev
R. K. Islamgaliev,,
-
, Krystyna Pękała (FP / SD)
Krystyna Pękała,,
- Semiconductors Division
, M. Pekala
M. Pekala,,
-
, R. Z. Valiev
R. Z. Valiev,,
-
Journal seriesPhysica Status Solidi A-Applications and Materials Science, ISSN 1862-6300
Issue year1997
Vol162
No2
Pages559–566
ASJC Classification2505 Materials Chemistry; 2208 Electrical and Electronic Engineering; 2508 Surfaces, Coatings and Films; 3110 Surfaces and Interfaces; 3104 Condensed Matter Physics; 2504 Electronic, Optical and Magnetic Materials
DOIDOI:10.1002/1521-396X(199708)162:2<559::AID-PSSA559>3.0.CO;2-Z
URL http://onlinelibrary.wiley.com/doi/10.1002/1521-396X(199708)162:2<559::AID-PSSA559>3.0.CO;2-Z/abstract
Languageen angielski
Score (nominal)25
Publication indicators Scopus SNIP (Source Normalised Impact per Paper): 2014 = 0.901; WoS Impact Factor: 2008 = 1.205 (2) - 2008=1.179 (5)
Citation count*12 (2014-08-27)
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