3-D electromagnetic analysis of the package influence on the IC performance

Zbigniew Nosal , Adam Abramowicz


An integrated circuit package has been analyzed using the 3-dimensional FDTD simulator. The finite isolation between IC leads and the lead impedances can be precisely computed. The computed characteristics have been used to develop a circuit model of the package. Then the influence of the package on the integrated circuit performance has been investigated with high-frequency circuit simulators. Presented results show the necessity of including package properties in the RF and microwave IC design process
Author Zbigniew Nosal (FEIT / PE)
Zbigniew Nosal,,
- The Institute of Electronic Systems
, Adam Abramowicz (FEIT / PE)
Adam Abramowicz,,
- The Institute of Electronic Systems
Pages561-564 vol.2
Publication size in sheets0.5
Book 13th International Conference on Microwaves, Radar and Wireless Communications. 2000. MIKON-2000, vol. 2, 2000
Keywords in English3D electromagnetic analysis, 3-dimensional FDTD simulator, Analytical models, circuit model, circuit simulation, computational modeling, Electric Impedance, electromagnetic analysis, finite difference methods, finite difference time-domain analysis, finite isolation, high-frequency circuit simulators, IC design, IC performance, impedance, integrated circuit package, integrated circuit packaging, lead impedances, microwave IC, Microwave integrated circuits, Radio frequency, RF IC, Time domain analysis
Languageen angielski
Score (nominal)0
Score sourcejournalList
Publication indicators WoS Citations = 1; Scopus Citations = 2; GS Citations = 3.0
Citation count*3 (2020-08-24)
Share Share

Get link to the record

* presented citation count is obtained through Internet information analysis and it is close to the number calculated by the Publish or Perish system.
Are you sure?