3-D electromagnetic analysis of the package influence on the IC performance

Zbigniew Nosal , Adam Abramowicz

Abstract

An integrated circuit package has been analyzed using the 3-dimensional FDTD simulator. The finite isolation between IC leads and the lead impedances can be precisely computed. The computed characteristics have been used to develop a circuit model of the package. Then the influence of the package on the integrated circuit performance has been investigated with high-frequency circuit simulators. Presented results show the necessity of including package properties in the RF and microwave IC design process
Author Zbigniew Nosal (FEIT / PE)
Zbigniew Nosal,,
- The Institute of Electronic Systems
, Adam Abramowicz (FEIT / PE)
Adam Abramowicz,,
- The Institute of Electronic Systems
Pages561-564 vol.2
Publication size in sheets0.5
Book 13th International Conference on Microwaves, Radar and Wireless Communications. 2000. MIKON-2000, vol. 2, 2000
Keywords in English3D electromagnetic analysis, 3-dimensional FDTD simulator, Analytical models, circuit model, circuit simulation, computational modeling, Electric Impedance, electromagnetic analysis, finite difference methods, finite difference time-domain analysis, finite isolation, high-frequency circuit simulators, IC design, IC performance, impedance, integrated circuit package, integrated circuit packaging, lead impedances, microwave IC, Microwave integrated circuits, Radio frequency, RF IC, Time domain analysis
DOIDOI:10.1109/MIKON.2000.913995
Languageen angielski
Score (nominal)0
Score sourcejournalList
Publication indicators WoS Citations = 1; Scopus Citations = 2; GS Citations = 3.0
Citation count*3 (2020-08-24)
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