Dedicated MEMS-based test structure for 3D SiP interconnects reliability investigation
Tomasz Bieniek , Grzegorz Janczyk , Rafał Dobrowolski , Szmigiel Dariusz , Magdalena Ekwińska , Piotr Grabiec , Paweł Janus , J. Zając
AbstractThis paper discusses important aspects of development process of dedicated test vehicles designed for investigation on thin metal layers reliability by a novel Accelerated Thermo-Mechanical Ageing method (ATMA)  being developed now. It is an ongoing research report presenting current state of the R&D works, investigation on ATMA usefulness and its applicability to interconnect reliability evaluation.
|Publication size in sheets||0.5|
|Book||Organizing Committee of Conference 3DIC: Proc. of IEEE International 3D Systems Integration Conference (3DIC), 2013, USA, IEEE, ISBN 978-1-4673-6484-3, 450 p.|
|Keywords in English||Accelerated ageing, MEMS test structure, 3D SiP|
|Score|| = 10.0, 17-09-2020, BookChapterMatConfByIndicator|
= 15.0, 17-09-2020, BookChapterMatConfByIndicator
|Publication indicators||= 8.0|
|Citation count*||8 (2018-12-13)|
* presented citation count is obtained through Internet information analysis and it is close to the number calculated by the Publish or Perish system.