Dedicated MEMS-based test structure for 3D SiP interconnects reliability investigation

Tomasz Bieniek , Grzegorz Janczyk , Rafał Dobrowolski , Szmigiel Dariusz , Magdalena Ekwińska , Piotr Grabiec , Paweł Janus , J. Zając

Abstract

This paper discusses important aspects of development process of dedicated test vehicles designed for investigation on thin metal layers reliability by a novel Accelerated Thermo-Mechanical Ageing method (ATMA) [1] being developed now. It is an ongoing research report presenting current state of the R&D works, investigation on ATMA usefulness and its applicability to interconnect reliability evaluation.
Author Tomasz Bieniek
Tomasz Bieniek,,
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, Grzegorz Janczyk (FEIT / MO)
Grzegorz Janczyk,,
- The Institute of Microelectronics and Optoelectronics
, Rafał Dobrowolski
Rafał Dobrowolski,,
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, Szmigiel Dariusz
Szmigiel Dariusz,,
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, Magdalena Ekwińska
Magdalena Ekwińska,,
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, Piotr Grabiec
Piotr Grabiec,,
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, Paweł Janus
Paweł Janus,,
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, J. Zając
J. Zając,,
-
Pages1-6
Publication size in sheets0.5
Book Organizing Committee of Conference 3DIC: Proc. of IEEE International 3D Systems Integration Conference (3DIC), 2013, USA, IEEE, ISBN 978-1-4673-6484-3, 450 p.
Keywords in EnglishAccelerated ageing, MEMS test structure, 3D SiP
DOIDOI:10.1109/3DIC.2013.6702375
URL http://ieeexplore.ieee.org/document/6702375/
Languageen angielski
File
Dedicated MEMS-based test structure...pdf 1.77 MB
Score (nominal)15
Score sourceconferenceIndex
ScoreMinisterial score = 10.0, 17-09-2020, BookChapterMatConfByIndicator
Ministerial score (2013-2016) = 15.0, 17-09-2020, BookChapterMatConfByIndicator
Publication indicators GS Citations = 8.0
Citation count*8 (2018-12-13)
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* presented citation count is obtained through Internet information analysis and it is close to the number calculated by the Publish or Perish system.
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