Electrical characterization of a RF power transistor ceramic package including multiple wirebonds
AbstractThis article presents an approach for modeling of RF power transistor packages including bondwires. The approach is based on measurements of a real package in which the transistor chip was replaced with a 2-port of known parameters and connected to the package leads with multiple parallel wirebonds. Using the measurement results, an equivalent circuit of the package is constructed. The response of the circuit is then compared to measurements and results obtained through full-wave electromagnetic modeling to reveal good agreement. © 2012 Wiley Periodicals, Inc. Int J RF and Microwave CAE, 2013.
|Journal series||International Journal of Rf and Microwave Computer-Aided Engineering, ISSN 1096-4290, [1099-047X]|
|Keywords in English||coupled wirebonds, equivalent circuit model, multiple wirebonds, power transistors, semiconductor device packaging|
|ASJC Classification||; ;|
|Score|| = 15.0, 07-01-2020, ArticleFromJournal|
= 20.0, 07-01-2020, ArticleFromJournal
|Publication indicators||= 1; = 1; = 3.0; : 2013 = 0.639; : 2013 = 0.845 (2) - 2013=0.667 (5)|
|Citation count*||3 (2015-02-22)|
* presented citation count is obtained through Internet information analysis and it is close to the number calculated by the Publish or Perish system.