Moire interferometry/termovision method for electronic package testing
Leszek Sałbut , Małgorzata Kujawińska
AbstractThe method combining moire interferometry and termovision techniques (MI/T) for thermally loaded elements testing is proposed. The methodology of the MI/T method applied for simultaneous in-plane displacement/strain and temperature distributions monitoring and measurement at electronic elements is described. The results of thermal tests performed at electronic chip UCY74S405N are presented.
|Publication size in sheets||0.5|
|Book||Gorecki Christophe (eds.): Proc. SPIE 3098, Optical Inspection and Micromeasurements II, 10, 1997|
|Publication indicators||= 2; = 2; = 5.0|
|Citation count*||5 (2020-09-07)|
* presented citation count is obtained through Internet information analysis and it is close to the number calculated by the Publish or Perish system.