Moire interferometry/termovision method for electronic package testing

Leszek Sałbut , Małgorzata Kujawińska

Abstract

The method combining moire interferometry and termovision techniques (MI/T) for thermally loaded elements testing is proposed. The methodology of the MI/T method applied for simultaneous in-plane displacement/strain and temperature distributions monitoring and measurement at electronic elements is described. The results of thermal tests performed at electronic chip UCY74S405N are presented.
Author Leszek Sałbut (FM / IMPh)
Leszek Sałbut,,
- The Institute of Micromechanics and Photonics
, Małgorzata Kujawińska (FM / IMPh)
Małgorzata Kujawińska,,
- The Institute of Micromechanics and Photonics
Pages10-17
Publication size in sheets0.5
Book Gorecki Christophe (eds.): Proc. SPIE 3098, Optical Inspection and Micromeasurements II, 10, 1997
DOIDOI:10.1117/12.281157
URL http://adsabs.harvard.edu/abs/1997SPIE.3098...10S
Languageen angielski
Score (nominal)3
Publication indicators Scopus Citations = 2; WoS Citations = 2; GS Citations = 5.0
Citation count*5 (2020-09-07)
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