Characterization thin films TiO2 obtained in the magnetron sputtering process

Maciej Kamiński , Piotr Firek , Piotr Caban

Abstract

The aim of the study was to elucidate influence parameters of magnetron sputtering process on growth rate and quality of titanium dioxide thin films. TiO2 films were produced on two inch silicon wafers by means of magnetron sputtering method. Characterization of samples was performed using ellipsometer and atomic force microscope (AFM). Currentvoltage (I-V) and capacitance-voltage (C-V) measurements were also carried out. The results enable to determine impact of pressure, power, gases flow and process duration on the physical parameters obtained layers such as electrical permittivity, flat band voltage and surface topography. Experiments were designed according to orthogonal array Taguchi method. Respective trends impact were plotted.
Author Maciej Kamiński IMiO
Maciej Kamiński,,
- The Institute of Microelectronics and Optoelectronics
, Piotr Firek IMiO
Piotr Firek,,
- The Institute of Microelectronics and Optoelectronics
, Piotr Caban
Piotr Caban,,
-
Pages1-8
Book Swatowska Barbara, Maziarz Wojciech, Pisarkiewicz Tadeusz, Kucewicz Wojciech (eds.): Proceedings of SPIE Electron Technology Conference 2016, vol. 1, no. 10175, 2016, SPIE, ISBN 9781510608436, 354 p., DOI:10.1117/12.2270351
Keywords in EnglishSputter deposition; Thin films; Titanium; Atomic force microscope; Capacitance; Gases; Silicon
DOIDOI:10.1117/12.2261873
URL http://proceedings.spiedigitallibrary.org/proceeding.aspx?articleid=2595296
Languageen angielski
Score (nominal)15
ScoreMinisterial score [Punktacja MNiSW] = 15.0, 27-03-2017, BookChapterMatConfByIndicator
Ministerial score (2013-2016) [Punktacja MNiSW (2013-2016)] = 15.0, 27-03-2017, BookChapterMatConfByIndicator
Citation count*0
Additional fields
Numer pracy1017516
Cite
Share Share

Get link to the record
msginfo.png


* presented citation count is obtained through Internet information analysis and it is close to the number calculated by the Publish or Perish system.
Back